Semiconductor device having tungsten gate electrode and method for fabricating the same

ABSTRACT

The present invention provides a semiconductor device in which the threshold voltage of NMOS and the threshold voltage of PMOS are independently controllable, and a method for fabricating the same. The method includes: forming a gate insulating film over an NMOS region and a PMOS region of a semiconductor substrate; forming a carbon-containing tungsten over the gate insulating film formed over one of the NMOS region and the PMOS region; forming a carbon-containing tungsten nitride over the gate insulating film formed over the other one of the PMOS region or the NMOS region; forming a tungsten film over the carbon-containing tungsten and the carbon-containing tungsten nitride; post-annealing the carbon-containing tungsten and the carbon-containing tungsten nitride; and etching the tungsten film, the carbon-containing tungsten, and the carbon-containing tungsten nitride, to form a gate electrode in the NMOS region and the PMOS region

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority of Korean Patent Application No10-2012-0096508, filed on Aug. 31, 2012, which is incorporated herein byreference in its entirety.

BACKGROUND

1. Field

Exemplary embodiments of the present invention relate to a semiconductordevice, and more particularly, to a semiconductor device having atungsten gate electrode and a method for fabricating the same.

2. Description of the Related Art

The requirements of next-generation CMOS circuits include low voltage,low power, high performance, high density and high reliability, whichare achieved by the scaling of CMOS circuits. Scaling of the thicknessof a gate insulating film results in various problems, including directtunneling, impurity diffusion from a gate electrode, deterioration inthe operating characteristics, reliability and lifetime of a gate, andso on. To achieve high capacitance, the thickness of the gate insulatingfilm should be reduced, but in this case, leakage current increases tocause problems associated with the operating characteristics andreliability of the gate.

A physical limit to the thickness of the gate insulating filmnecessitates the introduction of new materials having high dielectric(high-k) characteristics. A high-k gate insulating film to which a largethickness can be physically applied can substitute for a silicon oxidefilm and can significantly reduce leakage current to improve theoperating characteristics and reliability of the gate. The high-k gateinsulating film should have a dielectric constant value higher than asilicon oxide film, thermodynamic stability in high-temperature thermalprocesses, and an amorphous phase.

When the high-k gate insulating film is introduced, it is difficult touse an N-type polysilicon film and a P-type polysilicon film as gateelectrodes. This is because depletion is caused by impurity tunnelingbetween an impurity-doped polysilicon film and a channel, and thuscurrent decreases and charge trapping in an interfacial charge layerincreases, resulting in an unstable increase in threshold voltage.

Thus, when a metal film is used as a gate electrode, additional impuritydoping can be eliminated to reduce the number of processes, the gatedepletion problem can be solved, and high-speed operation becomespossible by the introduction of a metal film having a very lowresistance.

However, when a metal having a mid-gap work function is applied to bothPMOS and NMOS, a very high threshold voltage should be applied to turnon each transistor, and thus the requirements of a low-voltage,high-efficiency device are not satisfied. Thus, in order to maintain thethreshold voltage of a transistor at a low level to make the high-speedoperation thereof possible, a double metal gate electrode structure isnecessarily required.

SUMMARY

An exemplary embodiment of the present invention is directed to asemiconductor device in which the threshold voltage of NMOS and thethreshold voltage of PMOS are independently controllable, and a methodfor fabricating the same.

In accordance with an exemplary embodiment, semiconductor device mayinclude: a substrate including an NMOS region and a PMOS region; a firstgate electrode formed in one of the NMOS region or the PMOS region andcomprising a first tungsten-containing film containing a first workfunction control material; and a second gate electrode formed in theother one of the NMOS region or the PMOS region and comprising a secondtungsten-containing film containing a second work function controlmaterial that is different than the first work function controlmaterial.

In accordance an exemplary embodiment, a semiconductor device mayinclude: a substrate including an NMOS region and a PMOS region; a firstgate electrode formed in one of the NMOS region or the PMOS region, thefirst gate electrode comprising a stack of a carbon-containing tungstenfilm and a tungsten film; and a second gate electrode formed in theother one of the NMOS region or the PMOS region, the second gateelectrode comprising a stack of a carbon-containing tungsten nitridefilm and a tungsten film.

In accordance with an exemplary embodiment, a method for fabricating asemiconductor device may include: forming a gate insulating film over anNMOS region and a PMOS region of a semiconductor substrate; forming afirst tungsten-containing film, containing a first work function controlmaterial, over the gate insulating film formed over one of the NMOSregion or the PMOS region; forming a second tungsten-containing film,containing a second work function control material that is differentthan the first work function control material, over the gate insulatingfilm formed over the other one of the PMOS region or the NMOS region;post-annealing the first tungsten-containing film and the secondtungsten-containing film; and etching the first tungsten-containing filmand the second tungsten-containing film to form a gate electrode in theNMOS region and the PMOS region.

In accordance with an exemplary embodiment, a method for fabricating asemiconductor device may include: forming a gate insulating film over anNMOS region and a PMOS region of a semiconductor substrate; forming acarbon-containing tungsten over the gate insulating film formed over oneof the NMOS region or the PMOS region; forming a carbon-containingtungsten nitride over the gate insulating film formed over the other oneof the PMOS region or the NMOS region; forming a tungsten film over thecarbon-containing tungsten and the carbon-containing tungsten nitride;post-annealing the carbon-containing tungsten and the carbon-containingtungsten nitride; and etching the tungsten film, the carbon-containingtungsten, and the carbon-containing tungsten nitride, to form a gateelectrode in the NMOS region and the PMOS region

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a gate structure according toan exemplary embodiment.

FIG. 2 shows a method for forming a first tungsten-containing gateelectrode according to an exemplary embodiment.

FIG. 3 shows a method for forming a second tungsten-containing gateelectrode according to an exemplary embodiment

FIG. 4 illustrates the phase transition of a tungsten-containing film(W/FFWC) after post-annealing.

FIG. 5 illustrates the phase transition of a fluorine-free tungstennitride containing carbon (FFWNC) after post-annealing.

FIG. 6 illustrates grain size after post-heat treatment of W/FFWC.

FIG. 7 illustrates the grain size of W/FFWC after an exemplarypost-annealing.

FIG. 8 illustrates the fluorine-diffusion barrier function of anexemplary fluorine-free tungsten containing carbon (FFWC).

FIG. 9 illustrates the C-V characteristics of various materials whichare used for gate electrodes.

FIG. 10 shows a comparison between the resistivities of materials whichare used for gate electrodes.

FIGS. 11A to 11F show an example of a method for forming a gatestructure according to an exemplary embodiment.

DETAILED DESCRIPTION

Exemplary embodiments of the present invention will be described belowin more detail with reference to the accompanying drawings. The presentinvention may, however, be embodied in different forms and should not beconstrued as limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the present invention tothose skilled in the art. Throughout the disclosure, like referencenumerals refer to like parts throughout the various figures andembodiments of the present invention.

The drawings are not necessarily to scale and in some instances,proportions may have been exaggerated in order to clearly illustratefeatures of the embodiments. When a first layer is referred to as being“on” a second layer or “on” a substrate, it not only refers to a casewhere the first layer is formed directly on the second layer or thesubstrate but also a case where a third layer exists between the firstlayer and the second layer or the substrate.

FIG. 1 is a cross-sectional view showing a gate structure according toan exemplary embodiment.

Referring to FIG. 1, a semiconductor substrate 21 has a first regionNMOS, a second region PMOS, and a device isolation region 22 forisolation between the first region NMOS and the second region PMOS. Thedevice isolation region 22 has a trench structure and can be formed by ashallow trench isolation (STI) process. On the semiconductor substrate21, a gate insulating film 23 is formed of a high dielectric materialhaving a dielectric constant higher than that of general silicon oxide.

On the gate insulating film 23 in the first region NMOS, a fitungsten-containing gate electrode 201 is formed. The firsttungsten-containing gate electrode 201 comprises a firsttungsten-containing film pattern 24N and a third tungsten-containingfilm pattern 27N. The first tungsten-containing film pattern 24Ncontains a work function control material. The work function controlmaterial may include carbon. The first tungsten-containing film pattern24N may include a carbon-containing tungsten (W_(1-x)C_(x)). The firsttungsten-containing film pattern 24N may be formed to a thickness ofabout 20-30 Å. The carbon-containing tungsten has a low work function ofabout 4.5 eV or less. For example, about 4.2 eV to about −4.5 eV). Thislow work function is obtained by the carbon content (x) of thecarbon-containing tungsten. To control the carbon content (x), afluorine-free tungsten source containing carbon and hydrogen plasmatreatment may be used. The carbon content (x) may be about 10-15 at %(atomic percent). As described below, the carbon content (x) is thecontent after annealing has been performed.

On the gate insulating film 23 in the second region PMOS, a secondtungsten-containing gate electrode 202 is formed. The secondtungsten-containing gate electrode 202 comprises a secondtungsten-containing film pattern 26P and a third tungsten-containingfilm pattern 27P. The second tungsten-containing film pattern 26P maycontain a work function control material. The work function controlmaterial may include carbon and nitrogen. For example, the secondtungsten-containing film pattern 26P may include a tungsten containingcarbon and nitrogen (W_(1-x-y)N_(x)C_(y)). The tungsten containingcarbon and nitrogen (W_(1-x-y)N_(x)C_(y)) may be a carbon-containingtungsten nitride. The second tungsten-containing film pattern 26P may beformed to a thickness of about 20-30 Å. The carbon-containing tungstennitride has a low work function of about 5.2 eV or less. For example,about 4.9 eV to about 5.2 eV). This low work function is obtained by thecarbon content (y) and nitrogen content (x) of the carbon-containingtungsten. To control the carbon content (y) and nitrogen content (x) ofthe carbon-containing tungsten nitride, a fluorine-free tungsten sourcecontaining carbon and NH₃ plasma treatment may be used. The carboncontent (y) may be about 5-10 at %. The nitrogen content (x) may beabout 20-30 at %. As described below, the carbon content (y) and thenitrogen content (x) are the contents after annealing has beenperformed.

The third tungsten-containing films 27N and 27P contain tungsten (W).The third tungsten-containing film may comprise a bulk tungsten film ora stack of a tungsten nucleation film and a bulk tungsten film. Thetungsten nucleation film may be formed to a thickness of about 10-20 Å.To obtain low resistivity, the bulk tungsten film may have analpha-tungsten (α-W) phase. The bulk tungsten film has an alpha-tungsten(α-W) phase having a body-center cubic structure (BCC).

In FIG. 1, the first tungsten-containing film pattern 24N and the secondtungsten-containing film pattern 26P can serve as diffusion barriers.The first tungsten-containing film pattern 24N may include acarbon-containing tungsten, and the second tungsten-containing filmpattern 26P may include a carbon-containing tungsten nitride. Thecarbon-containing tungsten may include a fluorine-free tungstencontaining carbon (FFWC). The carbon-containing tungsten nitride mayinclude a fluorine-free tungsten nitride containing carbon (FFWNC).

Thus, the second tungsten-containing gate electrode 202 may be composedof a stack (W/FFWNC) of a fluorine-free tungsten nitride containingcarbon (FFWNC), a tungsten nucleation film and a bulk tungsten film. Inaddition, the second tungsten-containing gate electrode 202 may becomposed of a stack of a fluorine-free tungsten nitride containingcarbon (FFWNC) and a bulk tungsten film. The first tungsten-containinggate electrode 201 may be composed of a stack (W/FFWC) of afluorine-free tungsten containing carbon (FFWC), a tungsten nucleationfilm and a bulk tungsten film. In addition, the firsttungsten-containing gate electrode 201 may be composed of a stack of afluorine-free tungsten containing carbon (FFWC) and a bulk tungstenfilm.

As shown in FIG. 1, the NMOS region includes the firsttungsten-containing gate electrode 201, and the PMOS region includes thesecond tungsten-containing gate electrode 202. The firsttungsten-containing gate electrode 201 comprises the firsttungsten-containing film pattern 24N having a work function suitable forthe NMOS region. The second tungsten-containing gate electrode 202comprises the second tungsten-containing film pattern 26P having a workfunction suitable for the PMOS region.

Thus, according to an exemplary embodiment, the threshold voltage ofNMOS and the threshold voltage of PMOS can be independently controlled.

In addition, according to an exemplary embodiment, thetungsten-containing gate electrodes are formed of the fluoride-freetungsten containing carbon (FFWC) and the fluorine-free tungsten nitridecontaining carbon (FFWNC), and thus the their interfaces with the gateinsulating film 23 have excellent characteristics. Also, becausepolysilicon or titanium nitride is not used, the polysilicon depletionratio (PDR), Fermi-level pinning and resistance characteristics of thegate electrodes can be improved. Thus, a transistor capable of operatingat a high speed can be formed.

FIG. 2 shows a method for forming a first tungsten-containing gateelectrode according to an embodiment of the present invention.Hereinafter, the first tungsten-containing gate electrode will bereferred to as a stack (W/FFWC) of a fluorine-free tungsten containingcarbon (FFWC), a tungsten nucleation film and a bulk tungsten film.

Referring to FIG. 2, a method for forming a tungsten-containing film(W/FFWC) comprises forming a fluorine-free tungsten containing carbon(FFWC) at a step S101; forming a tungsten nucleation film at a stepS102; forming a bulk tungsten film at a step S103; and post-annealing ata step S104.

At the Step S101, fluorine-free tungsten containing carbon (FFWC) isformed.

The fluorine-free tungsten containing carbon (FFWC) may be formed byatomic layer deposition (ALD). The atomic layer deposition (ALD) can beperformed using a metal organic tungsten source. In the atomic layerdeposition (ALD), the fluorine-free tungsten containing carbon (FFWC)can be deposited to a desired thickness by performing a unit cycleconsisting of introducing a fluorine-free tungsten source at the stepS11, performing purging operation at the step S12, introducing areactant at the step S13, and performing a purging operation at the stepS14, and repeating the unit cycle several times at the step S15. Theatomic layer deposition may be carried out at a temperature of 150 to320° C. and a power of 250 W.

At the step S11, the fluorine-free tungsten source (FFWS), based on ametal organic compound, is adsorbed onto a substrate. The substrate maybe formed of any material (e.g., silicon) suitable for semiconductorprocesses and may comprise layers formed of dielectric or conductivematerials thereon. As used herein, the term “substrate surface” refersto the surface of either any substrate on which the fluorine-freetungsten source (FFWS) is deposited or a material formed on thesubstrate. For example, the substrate surface may comprise silicon,silicon oxide, high dielectric materials, silicon nitride, dopedsilicon, metals, metal nitride, or other conductive materials.

The fluorine-free tungsten source (FFWS) that is used in the embodimentof the present invention may be a metal organic tungsten source. Thefluorine-free tungsten source (FFWS) may include a metal organictungsten source containing no fluorine. The fluorine-free tungstensource (FFWS) may include a compound containing tungsten and carbon.Also, the fluorine-free tungsten source (FFWS) may include a compoundcontaining tungsten, carbon and nitrogen. Examples of the fluorine-freetungsten source (FFWS) may include, for example, C₈H₇NO₃W (dicarbonyl(η5-methyl-cyclopentadienyl) nitrosyl tungsten) or C₁₂H₃₀N₄W(bis(tert-butylimino) bis(dimethylamino) tungsten). A fluorine-freetungsten containing carbon (FFWC) deposited using the fluorine-freetungsten source (FFWS) may have decreased resistivity by the carboncontent thereof and can function as a barrier. Thus, the flow rate ofthe fluorine-free tungsten source (FFWS) can be controlled such that thecarbon content of the fluorine-free tungsten containing carbon (FFWC) isabout 40 at % (atomic percent) or less.

At the step S12, the purging operation is carried out in order to removea non-adsorbed fluorine-free tungsten source. The purging operation canbe performed in the presence of inert gas such as argon.

The step S13 of introducing the reactant is carried out by reacting thereactant with the adsorbed fluorine-free tungsten source (FFWS) todeposit a fluorine-free tungsten containing carbon (FFWC) in an atomiclayer unit. Herein, the reactant may include a reducing agent orreducing gas. The reactant may include a hydrogen-containing material.The step S13 of introducing the reactant may comprise treating ahydrogen-containing material with plasma. Step (S13) of introducing thereactant may comprise hydrogen (H₂) plasma treatment. When this hydrogenplasma treatment is carried out, the fluorine-free tungsten containingcarbon (FFWC) is deposited by reaction of the fluorine-free tungstensource with hydrogen. The carbon content of the fluorine-free tungstencontaining carbon (FFWC), which is deposited by hydrogen plasmatreatment, can be controlled to about 40 at % or less. To control thecarbon content, the conditions of hydrogen plasma treatment (e.g., apower of about 250 W) can be controlled. When hydrogen plasma treatmentis carried out, impurities contained in the fluorine-free tungstencontaining carbon (FFWC) can also be removed.

At the step S14, the purging operation is performed to remove anyunreacted reactant or reaction byproducts. The step of purging may becarried out in the presence of inert gas such as argon.

The fluorine-free tungsten containing carbon (FFWC) may be formed to adesired thickness by repeating the unit cycle, comprising introducing afluorine-free tungsten source at the step S11, performing a purgingoperation at the step S12, introducing a reactant at the step S13,performing a purging operation at the step S14, at the step S15, andrepeating the unit cycle a number of times as required to achieve thedesired thickness.

The fluorine-free tungsten containing carbon (FFWC) may be formed to athickness of about 20-30 Å. Because atomic layer deposition is used, thefilm has good step coverage. The carbon content of the fluorine-freetungsten containing carbon (FFWC) may be about 25-35 at %. This carboncontent is obtained based on the flow rate of the fluorine-free tungstensource and hydrogen plasma treatment.

The fluorine-free tungsten containing carbon (FFWC) is formed using ametal organic tungsten source containing no fluorine. Thus, the FFWCfilm contains no fluorine, and thus the surface of the underlyingsubstrate is not deteriorated. Also, the content of carbon in the FFWCfilm can be controlled by hydrogen plasma treatment. Particularly,because the carbon content of the FFWC film is controlled to be about 40at % or less, the FFWC film has decreased resistivity and functions as adiffusion barrier.

At the step S102, a tungsten nucleation film is formed on thefluorine-free tungsten containing carbon (FFWC). The tungsten nucleationfilm can be formed by atomic layer deposition (ALD) or chemical vapordeposition (CVD). When atomic layer deposition is used, it can becarried out in the same chamber as that in which the fluorine-freetungsten containing carbon (FFWC) is formed. The tungsten nucleationfilm can be formed using tungsten hexafluoride (WF₆) as a tungstensource and diborane (B₂H₆) as soaking gas. The tungsten nucleation filmmay be formed by introducing each of tungsten hexafluoride (WF₆) anddiborane (B₂H₆) about 5-6 times, for example, followed by purging.Because diborane (B₂H₆) is used as soaking gas, the tungsten nucleationfilm has an amorphous phase. Thus, the tungsten nucleation film haslarge grains and low resistivity. The tungsten nucleation film is formedto a small thickness of about 20 Å or less. The flow rate of diborane(B₂H₆) is about 300 sccm or more, and the process temperature is about350° C. or less. Because the tungsten nucleation film has an amorphousphase, a bulk tungsten film (which is formed in a subsequent process)can have a large grain size. The tungsten nucleation film is a thintungsten layer acting as a site for the growth of a bulk tungsten film.

At the step S103, a bulk tungsten film is formed on the tungstennucleation film. The bulk tungsten film can be formed using tungstenhexafluoride (WF₆) and hydrogen (H₂). The resistivity of the tungstennucleation film is very high when compared to the resistivity of thebulk tungsten film. Thus, in order to obtain low resistivity, it wouldbe preferable to omit the tungsten nucleation film if possible. However,if the bulk tungsten film is deposited directly on the fluorine-freetungsten containing carbon, the sheet resistance uniformity thereof willbe reduced. For this reason, the tungsten nucleation film is formed asthin as possible. The bulk tungsten film can be deposited at a processtemperature of about 400° C. or higher so as to have an alpha-tungsten(α-W) phase having a body-centered cubic structure of low resistivity.The bulk tungsten film can be formed by chemical vapor deposition oratomic layer deposition.

Accordingly, a tungsten-containing film having a stack comprising thefluorine-free tungsten containing carbon (FFWC), the tungsten nucleationfilm and the bulk tungsten film can be formed. Since the fluorine-freetungsten containing carbon (FFWC) is a diffusion barrier and thetungsten nucleation film and the bulk tungsten film are electrodes, thetungsten-containing film may be considered to be a stack of “W/FFWC”.The fluorine-free tungsten containing carbon (FFWC) contains nofluorine, and the tungsten nucleation film and the bulk tungsten filmcontain no fluorine or can contain a very small amount of fluorine. Evenif the tungsten nucleation film and the bulk tungsten film contain avery small amount of fluorine, the diffusion of fluorine to thesubstrate can be prevented, because the fluorine-free tungstencontaining carbon (FFWC) functions as a diffusion barrier.

A fluorine-free tungsten source such as C₈H₇NO₃W or C₁₂H₃₀N₄W may alsobe used to form the tungsten nucleation film and the bulk tungsten film.However, the use of a fluorine-free tungsten source is disadvantageousin terms of resistivity, because the resultant film contains carbon.

At the step S104, after the tungsten-containing film comprising thefluorine-free tungsten containing carbon (FFWC), the tungsten nucleationfilm and the bulk tungsten film has been formed, post-annealing iscarried out in order to reduce the resistivity of the film. Thepost-annealing may include rapid thermal processing (RTP). Thepost-annealing can be carried out for about 1 hour. The post-annealingcan be carried out in a nitrogen (N₂) atmosphere in order to prevent theoxidation of the tungsten-containing film (W/FFWC). The post-annealingcan be carried out at a temperature of about 800° C.

When the post-annealing is carried out, the grain size of thetungsten-containing film (W/FFWC) is increased using thermal energy. Thetungsten-containing film undergoes a phase change so as to have a lowcoordination number. Also, the carbon concentration and resistivitythereof are reduced. Therefore, very small grains of the W₂C phase andbeta-tungsten (β-W) phase of the tungsten-containing film are changed tovery large grains of an alpha-tungsten (α-W) phase by step (S38) ofpost-annealing.

For example, the carbon concentration of the tungsten-containing film(W/FFWC) is reduced to about 20 at % or less. For example, about 10-15at %, by the post-annealing. The grain size of the film is increased byabout 10 times or more. As a result, the tungsten-containing film(W/FFWC) subjected to post-annealing has a reduced carbon concentrationand an increased grain size, and thus the resistivity thereof is reducedby about 80% or more compared to that before post-annealing.

FIG. 3 shows a method for forming a second tungsten-containing gateelectrode according to an exemplary embodiment. Hereinafter, the secondtungsten-containing gate electrode will be referred to as atungsten-containing film (W/FFWNC) composed of a stack of afluorine-free tungsten nitride containing carbon (FFWNC), a tungstennucleation film and a bulk tungsten film.

Referring to FIG. 3, a method for forming the tungsten-containing film(W/FFWNC) comprises forming a fluorine-free tungsten nitride containingcarbon (FFWNC) at a step S201; forming a tungsten nucleation film at astep S202; forming a bulk tungsten film at a step S203; and performingpost-annealing at a step S204.

At the Step S201, the fluorine-free tungsten nitride containing carbon(FFWNC) can be formed by atomic layer deposition (ALD). The atomic layerdeposition (ALD) can be performed using a metal organic tungsten source.In the atomic layer deposition (ALD), the fluorine-free tungsten nitridecontaining carbon (FFWNC) may be deposited to a desired thickness byperforming a unit cycle consisting of introducing a fluorine-freetungsten source at a step S21, performing a purging operation at a stepS22, introducing a reactant at a step S23, and performing a purgingoperation at a step S24, and repeating the unit cycles several times ata step S25. The atomic layer deposition may be carried out at atemperature of about 150 to 320° C. and a power of about 250 W.

At the step S21, the fluorine-free tungsten source (FFWS) based on ametal organic compound is adsorbed onto a substrate. Herein, thesubstrate may be formed of any material (e.g., silicon) suitable forsemiconductor processes and may comprise layers formed of dielectric orconductive materials thereon. As used herein, the term “substratesurface” refers to the surface of either any substrate on which thefluorine-free tungsten nitride containing carbon (FFWNC) is deposited ora material formed on the substrate. For example, the substrate surfacemay comprise silicon, silicon oxide, high dielectric materials, siliconnitride, doped silicon, metals, metal nitride, or other conductivematerials.

The fluorine-free tungsten source (FFWS) that is used in an exemplaryembodiment may be a metal organic tungsten source. The fluorine-freetungsten source (FFWS) may include a metal organic tungsten sourcecontaining no fluorine. The fluorine-free tungsten source (FFWS) mayinclude a compound containing tungsten and carbon. Also, thefluorine-free tungsten source (FFWS) may include a compound containingtungsten, carbon and nitrogen. Examples of the fluorine-free tungstensource (FFWS) may include, for example, C₈H₇NO₃W or C₁₂H₃₀N₄W. Afluorine-free tungsten nitride containing carbon (FFWNC) deposited usingthe fluorine-free tungsten source (FFWS) may have decreased resistivityby the carbon content thereof and can function as a diffusion barrier.Thus, the flow rate of the fluorine-free tungsten source (FFWS) may becontrolled such that the carbon content of the fluorine-free tungstennitride containing carbon (FFWNC) is about 40 at % (atom percent) orless.

At the step S22, the purging operation is carried out in order to removea non-adsorbed fluorine-free tungsten source. The step of purging can beperformed in the presence of inert gas such as argon.

At the step S23 of introducing a reactant is carried out by reacting thereactant with the adsorbed fluorine-free tungsten source (FFWS) todeposit a fluorine-free tungsten nitride containing carbon (FFWNC) in anatomic layer unit. Herein, the reactant may include a reducing agent orreducing gas. The reactant may include a hydrogen-containing material.At the step S23, introducing the reactant may comprise treating ahydrogen-containing material with plasma. At the step S23, theintroducing of the reactant may comprise NH₃ plasma treatment. When thisNH₃ plasma treatment is carried out, the fluorine-free tungsten nitridecontaining carbon (FFWNC) is deposited. The carbon and nitrogen contentsof the fluorine-free tungsten nitride containing carbon (FFWNC) may becontrolled. To control the carbon and nitrogen contents, the conditionof NH₃ plasma treatment (e.g., a power of about 250 W) may becontrolled. When NH₃ plasma treatment is carried out, any impuritycontained in the fluorine-free tungsten nitride containing carbon(FFWNC) can also be removed. As a result, the work function of the filmmay be controlled by controlling the conditions of NH₃ plasma treatment.

At the step S24, the purging operation is performed to remove anyunreacted reactant or reaction byproducts. The step of purging may becarried out in the presence of inert gas such as argon.

The fluorine-free tungsten nitride containing carbon (FFWNC) can beformed to a desired thickness by repeating the unit cycle, comprisingstep (S21) of introducing a fluorine-free tungsten source, step (S22) ofpurging, step (S23) of introducing a reactant, and (S24) of purging, atstep (S25) a number of times as required to achieve the desiredthickness. The fluorine-free tungsten nitride containing carbon (FFWNC)may be formed to a thickness of about 20-30 Å. Because atomic layerdeposition is used, the film has good step coverage.

The fluorine-free tungsten nitride containing carbon (FFWNC) is formedusing a metal organic tungsten source containing no fluorine. Thus, theFFWNC film contains no fluorine, and the surface of the underlyingsubstrate is not deteriorated. Also, the content of carbon in the FFWNCfilm may be controlled by the NH₃ plasma treatment. Particularly,because the carbon content of the FFWNC film is controlled to be about40 at % or less, the FFWNC film has decreased resistivity and functionsas a diffusion barrier.

At the step 202, on the fluorine-free tungsten nitride containing carbon(FFWNC), a tungsten nucleation film is formed. The tungsten nucleationfilm can be formed by atomic layer deposition (ALD) or chemical vapordeposition (CVD). When atomic layer deposition is used, it may becarried out in the same chamber as that in which the fluorine-freetungsten nitride containing carbon (FFWNC) is formed.

The tungsten nucleation film may be formed using tungsten hexafluoride(WF₆) as a tungsten source and diborane (B₂H₆) as soaking gas. Thetungsten nucleation film may be formed by introducing each of tungstenhexafluoride (WF₆) and diborane (B₂H₆) about 5-6 times, for example,followed by purging. Because diborane (B₂H₆) is used as soaking gas, thetungsten nucleation film has an amorphous phase. Thus, the tungstennucleation film has large grains and low resistivity. The tungstennucleation film is formed to a small thickness of about 20 Å or less.The flow rate of diborane (B₂H₆) is 300 sccm or more, and the processtemperature is about 350° C. or below. Because the tungsten nucleationfilm has an amorphous phase, a bulk tungsten film which is formed in asubsequent process may have a large grain size. The tungsten nucleationfilm is a thin tungsten layer acting as a site for the growth of a bulktungsten film.

At the step 203, a bulk tungsten film is formed on the tungstennucleation film. The bulk tungsten film may be formed using tungstenhexafluoride (WF₆) and hydrogen (H₂). The resistivity of the tungstennucleation film is very high when compared to a resistivity of the bulktungsten film. Thus in order to obtain low resistivity, it would bepreferable to omit the tungsten nucleation film, if possible. However,if the bulk tungsten film is deposited directly on the fluorine-freetungsten nitride containing carbon, the sheet resistance uniformitythereof will be reduced. For this reason, the tungsten nucleation filmis formed as thin as possible. The bulk tungsten film can be depositedat a process temperature of about 400° C. or higher so as to have analpha-tungsten (α-W) phase having a body-centered cubic structure of lowresistivity. The bulk tungsten film may be formed by chemical vapordeposition or atomic layer deposition.

Accordingly, a tungsten-containing film having a stack comprising thefluorine-free tungsten nitride containing carbon (FFWNC), the tungstennucleation film and the bulk tungsten film may be formed. Since thefluorine-free tungsten nitride containing carbon (FFWNC) is a diffusionbarrier and the tungsten nucleation film and the bulk tungsten film areelectrodes, the tungsten-containing film may be considered to be a stackof “W/FFWNC”. The fluorine-free tungsten nitride containing carbon(FFWNC) contains no fluorine, and the tungsten nucleation film and thebulk tungsten film contain no fluorine or can contain a very smallamount of fluorine. Even if the tungsten nucleation film and the bulktungsten film contain a very small amount of fluorine, the diffusion offluorine to the substrate can be prevented, because the fluorine-freetungsten nitride containing carbon (FFWNC) functions as a diffusionbarrier.

A fluorine-free tungsten source, such as C₈H₂NO₃W or C₁₂H₃₀N₄W, may alsobe used to form the tungsten nucleation film and the bulk tungsten film.However, the use of a fluorine-free tungsten source is disadvantageousin terms of resistivity, because the film contains carbon.

At the step 204, after the tungsten-containing film (W/FFWNC),comprising the fluorine-free tungsten nitride containing carbon (FFWNC),the tungsten nucleation film and the bulk tungsten film, has beenformed, post-annealing is carried out in order to reduce the resistivityof the film. The post-annealing may include rapid thermal processing(RTP). The post-annealing can be carried out for about 1 hour. Thepost-annealing can be carried out in a nitrogen (N₂) atmosphere in orderto prevent the oxidation of the tungsten-containing film (W/FFWNC). Thepost-annealing can be carried out at a temperature of about 800° C.

When the post-annealing is carried out, the grain size of thetungsten-containing film (W/FFWNC) is increased using thermal energy.The tungsten-containing film undergoes a phase change so as to have alow coordination number. Also the carbon concentration and resistivitythereof are reduced. Grains of the tungsten-containing film are changedto very large grains of an alpha-tungsten (α-W) phase by post-annealing.

For example, the carbon concentration of the tungsten-containing film(W/FFWNC) is reduced to about 10 at % or less. For example, about 5-10at %, by post-annealing. The nitrogen content of the tungsten-containingfilm (W/FFWNC) is about 20-30 at %. The grain size of the film isincreased by about 10 times or more. As a result, thetungsten-containing film (W/FFWNC), subjected to post-annealing, has areduced carbon concentration and an increased grain size. Thus, theresistivity thereof is reduced by about 80% or more compared to thatbefore post-annealing.

Table 1 below shows changes in the resistivities of thetungsten-containing films (W/FFWC and W/FFWNC). In thetungsten-containing films (W/FFWC and W/FFWNC), each of FFWC and FFWNChas a thickness of 20 Å, and W has a thickness of 40 Å.

TABLE 1 W/FFWC W/FFWNC Conditions Items (40Å/20Å) (40Å/20Å) As-depositedstate Resistivity 143.4 μohm-cm 243.2 μohm-cm After post-annealingResistivity  27.1 μohm-cm  51.3 μohm-cm

As can be seen in Table 1, the tungsten-containing film (W/FFWC) had aresistivity of about 143.4 μohm-cm, but the resistivity was reduced to27.1 μohm-cm by post-annealing.

The tungsten-containing film (W/FFWNC) had a resistivity of about 243.2μohm-cm, but the resistivity was reduced to 51.3 μohm-cm.

As described above, the resistivities of the tungsten-containing films(W/FFWC and W/FFWNC) were reduced by post-annealing by about 80% ormore, as compared to the pre-post-annealing values.

Table 2 below shows the changes in the work functions oftungsten-containing films as a function of the carbon contents thereof.Samples of tungsten-containing films were prepared. A first sample[W/FFWC (40 Å/20 Å)], a second sample [W/FFWC (40 Å/20 Å)+ANL], a thirdsample [W/FFWC (30 Å/30 Å)], a fourth sample [W/FFWC (30 Å/30 Å)+ANL], afifth sample (W/FFWNC1+ANL) and a sixth sample (W/FFWNC2+ANL) wereprepared. In Table 2, the results for the first sample are those foras-deposited W/FFWC (40 Å/20 Å), and the results for the second sample(W/FFWC+ANL) are those for post-annealed W/FFWC (40 Å/20 Å). The resultsfor the third sample are those for as-deposited W/FFWC (30 Å/30 Å), andthe results for the fourth sample (W/FFWC+ANL) are those forpost-annealed W/FFWC (30 Å/30 Å). The fifth sample (W/FFWNC1+ANL) had ahigh carbon content after post-annealing, and the sixth sample(W/FFWNC2+ANL) had a low carbon content after post-annealing.

TABLE 2 Conditions Work function Carbon content W/FFWC (40Å/20Å) 4.46about 25-30 at % W/FFWC (40Å/20Å) + 4.29 about 10 at % ANL W/FFWC(30Å/30Å) 4.54 about 0-35 at % W/FFWC (30Å/30Å) + 4.43 about 15 at % ANLW/FFWNC1 + ANL 4.92 about 20 at % (40 at % in as-deposited state)W/FFWNC2 + ANL 5.01 about 5-10 at % (20 at % in as-deposited state)

As can be seen in Table 2 above, the tungsten-containing film (W/FFWC)comprising the fluorine-free tungsten containing carbon (FFWC) ismaintained at a low carbon content of about 10-15 at % bypost-annealing, and has a low work function of about 4.2-4.5 eV.

Also, the tungsten-containing film (W/FFWNC) comprising thefluorine-free tungsten nitride containing carbon (FFWNC) has a decreasedcarbon content as a result of post-annealing. For example, a carboncontent of about 40 at % in the as-deposited state is decreased to about20 at % after post-annealing. In addition, a carbon content of about 20at % in the as-deposited state is decreased to about 5-10 at % afterpost-annealing.

It can be seen that the work function of the tungsten-containing film(W/FFWNC) comprising the fluorine-free tungsten nitride containingcarbon (FFWNC) changes depending on the carbon content thereof. Forexample, when the film has a high carbon content of about 20 at % afterpost-annealing, it has a work function of about 4.92 eV, and when it hasa low carbon content of about 5-10 at % after post-annealing, it has ahigh work function of about 5.01 eV. The work function of thefluorine-free tungsten nitride containing carbon (FFWNC) can depend notonly on the carbon content, but also on the nitrogen content. Thenitrogen content for obtaining the work function shown in Table 2 isabout 20-30 at %.

As can be seen from the results in Table 2, the tungsten-containing film(W/FFWC) comprising the fluorine-free tungsten containing carbon (FFWC)can have a work function suitable for NMOS by controlling the carboncontent through control of hydrogen plasma treatment conditions andcarrying out of post-annealing.

The tungsten-containing film (W/FFWC) comprising the fluorine-freetungsten containing carbon (FFWC) can have a work function suitable forPMOS by controlling the carbon content through control of NH₃ plasmatreatment conditions and carrying out of post-annealing.

FIG. 4 illustrates the phase transition of the tungsten-containing film(W/FFWC) after post-annealing. FIG. 4 shows the results for W/FFWC (40Å/20 Å) and W/FFWC (40 Å/30 Å).

As can be seen in FIG. 4, the crystalline phase in the as-depositedstate (As-dep) is a beta phase (β-W), but is converted to an alpha phase(α-W) by post-annealing (Post-ANL). When the thickness of FFWC is about30 Å, a weak W₂C phase can appear, but in the case of W/FFWC (40 Å/30Å), a strong alpha phase (α-W) appears, suggesting that the W/FFWC hasan increased grain size.

FIG. 5 illustrates the phase transition of the fluorine-free tungstennitride containing carbon (FFWNC) after post-annealing. FIG. 5 shows theresults for FFWNC (15 at %) and FFWNC (30 at %). 15 at % and 30 at % arecarbon contents.

As can be seen in FIG. 5, the fluorine-free tungsten nitride containingcarbon (FFWNC) converted to an alpha phase (α-W) by performingpost-annealing (Post-ANL). A WC phase, a WN phase and a W2N phase arenot substantially observed.

When the carbon content is about 30 at %, the alpha phase (α-W) is notobserved, but the carbon content is about 15 at %, the alpha phase (α-W)is strongly observed.

FIG. 6 illustrates the grain size of W/FFWC after post-annealing. As canbe seen therein, the grain size is increased by performingpost-annealing (Post-ANL) compared to that of the as-deposited state(As-dep).

FIG. 7 illustrates the grain size of W/FFWNC after post-annealing. Ascan be seen therein, the grain size is increased by performingpost-annealing (Post-ANL) compared to that of the as-deposited state(As-dep). At carbon contents of about 40 at % and about 20 at %, thegrain size increases. Meanwhile, it can be seen that, when the carboncontent is as low as about 20 at %, the grain size further increases.

FIG. 8 illustrates the fluorine-diffusion barrier function of thefluorine-free tungsten containing carbon (FFWC).

The results in FIG. 8 show a comparison of fluorine-diffusion barrierfunction between W/FFWC comprising the fluorine-free tungsten containingcarbon (FFWC) as a barrier and W/TiN comprising titanium nitride (TIN)as a barrier. Each of the fluorine-free tungsten (FFW) and the titaniumnitride (TiN) has a thickness of about 30 Å, and the tungsten layer hasa thickness of about 30 Å.

As can be seen in FIG. 8, the peak of fluorine (F) in W/FFWC is lowerthan that in W/TiN, suggesting that the fluorine diffusion-preventingeffect of the fluorine-free tungsten containing carbon (FFWC) is greaterthan that of the titanium nitride (TIN).

This fluorine diffusion-preventing effect can also be exhibited inW/FFWNC, and the fluorine diffusion-preventing effect of W/FFWNC isgreater than that of W/TiN.

FIG. 9 illustrates the C-V characteristics of various materials whichare used for gate electrodes. The results in FIG. 9 show a comparisonbetween W/FFWC, W/TiN, and W/FFWNC. W/FFWC, W/TiN, and W/FFWNC were allpost-annealed.

As can be seen in FIG. 9, when the fluorine-free tungsten containingcarbon (FFWC) is used, the threshold voltage (Vt) of the gate electrodecan be changed to the same level as that of TiN and in the minus (−)direction.

Also, it can be seen that, when the fluorine-free tungsten nitridecontaining carbon (FFWNC) is used, the threshold voltage (Vt) of thegate electrode can be changed to the same level as that of TIN and inthe plus (+) direction.

FIG. 10 shows a comparison between the resistivities of materials thatmay be used for gate electrodes.

FIG. 10 shows a comparison between a first sample (W/TiN) comprising astack of titanium nitride and tungsten, a second sample (W/WN)comprising a stack of tungsten nitride and tungsten, and a third sample(W/FFWC) comprising fluorine-free tungsten containing carbon (FFWC) andtungsten. The second sample (W/WN) was annealed by RTP before depositionof tungsten, and the third sample was annealed after deposition offluorine-free tungsten containing carbon (FFWC) and tungsten. Tungstenin each of the first, second and third samples is used as a gateelectrode, and each of titanium nitride (TIN), tungsten nitride (WN) andfluorine-free tungsten containing carbon (FFWC) is used as a tungstendiffusion barrier.

As can be seen in FIG. 10, the resistivity of the third sample (W/FFWC)comprising fluorine-free tungsten containing carbon (FFWC) as adiffusion barrier is significantly lower than those of the first sample(W/TiN) and the second sample (W/WN).

For example, if the second sample and the third sample each has athickness of about 60 Å, then the resistivity of the second sample isabout 100 μohm-cm, but the resistivity of the third sample is about 40μohm-cm. The first sample has a very high resistivity of about 240μohm-cm.

As can be seen in Table 2 above, the resistivity of W/FFWNC comprisingthe fluorine-free tungsten nitride containing carbon (FFWNC) as adiffusion barrier is significantly lower than those of the first sample(W/TiN) and the second sample (W/WN).

As described above, according to an exemplary embodiment in which thefluorine-free tungsten containing carbon (FFWC) and the fluorine-freetungsten containing nitride carbon (FFWNC) are used as diffusionbarriers, tungsten gate electrodes having resistivities lower than thoseof tungsten gate electrodes comprising tungsten nitride and titaniumnitride as barriers are be formed.

FIGS. 11A to 11F show an example of a method for forming a gatestructure according to an exemplary embodiment. A method for fabricatinga CMOS circuit will be described. However, the scope of the presentinvention is not limited to a CMOS circuit. The present invention isapplicable to all semiconductor fabrication methods in which NMOS andPMOS are formed. In addition, the present invention is applicable toeach of an NMOS fabrication method and a PMOS fabrication method. NMOSand PMOS are formed in a CMOS circuit. The CMOS circuit includes atleast one PMOS and at least one NMOS.

As shown in FIG. 11A, a semiconductor substrate 21 has a first regionNMOS, a second region PMOS, and a device isolation region for isolationbetween the first region NMOS and the second region PMOS. The deviceisolation region 22 has a trench structure and can be formed by ashallow trench isolation (STI) process. The device isolation region 22may include an insulting film (e.g., a silicon oxide film). The firstregion NMOS is a region in which NMOS is formed, and the second regionPMOS is a region in which PMOS is formed. The locations of the firstregion NMOS and the second region PMOS are for convenience ofdescription and may also be changed with each other. Examples of thesemiconductor substrate 21 include, but are not limited to, thosecomposed of silicon, germanium, or silicon germanium. In addition, allor part of the semiconductor substrate 21 may be strained. The deviceisolation region 22 may include an insulating film (e. g., a siliconoxide film). Although not shown in the drawings, a first well and asecond well may be formed in the first region NMOS and the second wellPMOS, respectively, by a conventional process for forming wells. In thefirst region NMOS, a P-type first well may be formed, and in the secondregion PMOS, an N-type second well may be formed. To form the N-typesecond well, an N-type impurity, such as phosphorus (P) or arsenic (As)can be implanted into the second region PMOS of the substrate 101. Toform the P-type first well, a P-type impurity, such as boron (B), can beimplanted into the first region NMOS of the substrate 101. Although notshown in the drawings, a channel region may be formed in each of thefirst region NMOS and the second region PMOS by a conventional channelion implantation process after the well formation process.

Then, a gate insulating film 23 is formed on the semiconductor substrate21. The gate insulating film 23 at least includes a high dielectric(high-k) film. In addition, an interfacial layer (not shown) may beformed between the semiconductor substrate 21 and the gate insulatingfilm 23. The structure of the gate insulating film 23 is the samebetween the first region NMOS and the second region PMOS. In otherwords, the portions of the gate insulating film 23 in NMOS and PMOS areformed of the same material.

An example of a method for forming the gate insulating film 23 is asfollows.

First, native oxide is removed from the surface of the semiconductorsubstrate 21 by a cleaning process. The cleaning process is carried outusing a solution containing hydrofluoric acid (HF). When the cleaningprocess is carried out, native oxide is removed from the surface of thesemiconductor substrate 21, and at the same time, dangling bonds on thesurface of the semiconductor substrate 21 are passivated with hydrogenso that the growth of native oxide is suppressed until a subsequentprocess is carried out.

Then, an interfacial layer is formed. The interfacial film includes aninsulating material, for example, silicon oxide (SiO₂). The interfaciallayer functions to improve the characteristics of the interface betweenthe semiconductor substrate 21 and the gate insulating film 23, therebyimproving electron mobility. As the interfacial film, silicon oxide canbe grown by a wet process. The interfacial layer is grown to a thicknessof about 10 Å or less.

Then, a gate insulating film 23 is formed. The gate insulating film 23includes a high dielectric (high-k) material (hereinafter referred to asa “high dielectric film”). The high dielectric film has a dielectricconstant which is significantly higher than that of silicon oxide (SiO₂)(about 3.9). Also, the high dielectric film is significantly thickerthan silicon oxide and has a lower equivalent oxide thickness (EOT)value. For example, the high dielectric film includes a metal-containingmaterial, such as a metal oxide, a metal silicate, or a metal silicatenitride. The metal oxide includes an oxide containing a metal, such ashafnium (Hf), aluminum (Al), lanthanum (La), or zirconium (Zr). Themetal oxide may include hafnium oxide (HfO₂), aluminum oxide (Al₂O₃),lanthanum oxide (LaO₂), or zirconium oxide (ZrO₂). The metal silicateincludes a silicate containing a metal, such as hafnium (Hf) orzirconium (Zr). The metal silicate may include, for example, hafniumsilicate (HfSiO) or zirconium silicate (ZrSiO_(x)). Examples of themetal silicate nitride include, for example, hafnium silicate nitride(HfSiON) or zirconium silicate nitride (ZrSiON). When the gateinsulating film 23 is formed of a metal silicate nitride, the dielectricconstant thereof can be increased and the crystallization thereof insubsequent processes can also be suppressed. Because the high dielectricfilm is used in both NMOS and PMOS, the process is simplified.Meanwhile, different high dielectric films may also be used in NMOS andPMOS. The process for forming the high dielectric film may includedeposition technology suitable for the material to be deposited.Examples of this deposition technology include chemical vapor deposition(CVD), low-pressure CVD (LPCVD), plasma-enhanced CVD (PECVD),metal-organic CVD (MOCVD), atomic layer deposition (ALD),plasma-enhanced ALD (PEALD) and the like. For formation of a uniformthin film, plasma-enhanced ALD (PEALD) can be used.

On the gate-insulating film 23, a first tungsten-containing film 24A isformed. The first tungsten-containing film 24A may contain a first workfunction control material. The first work function control material mayinclude carbon. For example, the first tungsten-containing film 24A mayinclude a fluorine-free tungsten containing carbon (FFWC). The firsttungsten-containing film 24A can be formed to a thickness of about 20-30Å. For a method for forming the fluorine-free tungsten containing carbon(FFWC) serving as the first tungsten-containing film 24A, reference ismade to FIG. 2 and the description thereof.

As shown in FIG. 11B, a first mask pattern 25 is formed on the firsttungsten-containing film 24A such that it covers the first region NMOSand opens the second region PMOS. The first mask pattern 25 may beformed of photoresist.

Using the first mask pattern 25 as an etch mask, the firsttungsten-containing film 24A is etched. Thus, in the first region NMOS,a first tungsten-containing film pattern 24B is formed, and in thesecond region PMOS, the first tungsten-containing film does not remain.

As shown in FIG. 11C, the first mask pattern 25 is removed, and then asecond tungsten-containing film 26A is formed on the entire surfaceincluding the first tungsten-containing film pattern 24B. The secondtungsten-containing film 26A may contain a second work function controlmaterial. The second work function control material may include carbonand nitrogen. For example, the second tungsten-containing film 26A mayinclude a fluorine-free tungsten nitride containing carbon (FFWNC). Thesecond tungsten-containing film 26A can be formed to a thickness ofabout 20-30 Å. For a method for forming the fluorine-free tungstennitride containing carbon (FFWNC) serving as the secondtungsten-containing film 26A, reference is made to FIG. 3 and thedescription thereof.

As shown in FIG. 11D, the second tungsten-containing film 26A isplanarized. Thus, a second tungsten-containing film pattern 26B isformed in the second region PMOS. In the first region NMOS, the firsttungsten-containing film pattern 24B remains.

As shown in FIG. 11E, a third tungsten-containing film 27 may be formedon the first tungsten-containing film pattern 24B and the secondtungsten-containing film 26B in order to reduce the resistance of thegate electrode. The third tungsten-containing film 27 may include atungsten film. The third tungsten-containing film 27 may include atungsten nucleation film and a bulk tungsten film. For example, the bulktungsten film may be formed after formation of the tungsten nucleationfilm.

For formation of the third tungsten-containing film 27, reference ismade to the methods for forming the tungsten nucleation film and thebulk tungsten film as described above with reference to FIGS. 2 and 3.

When the third tungsten-containing film 27 is formed as described above,a tungsten-containing material composed of a stack of the firsttungsten-containing film pattern 24B and the third tungsten-containingfilm 27 is formed in the first region NMOS. In the second region PMOS, atungsten-containing material composed of a stack of the secondtungsten-containing film pattern 26B and the third tungsten-containingfilm 27 is formed. The tungsten-containing materials, which are formedin the first region NMOS and the second region PMOS, may containdifferent work function control materials. The tungsten-containingmaterial, which is formed in the first region NMOS, may include carbonas a work function control material. The tungsten-containing materialwhich is formed in the second region PMOS may include carbon andnitrogen as work function control materials.

After the third tungsten-containing film 27 has been formed as describedabove, post-annealing 28 is performed. For the post-annealing 28,reference is made to the post annealing step described above withreference to FIGS. 2 and 3.

As a result, the first tungsten-containing film pattern 24B, the secondtungsten-containing film pattern 26B and third tungsten-containing film27, which were subjected to the post-annealing 28, has a decreasedcarbon concentration and an increased grain size, and thus theresistivities thereof are decreased by about 80% or more compared tothose of the as-deposited states.

As shown in FIG. 11F, a second mask pattern 29 is formed on the thirdtungsten-containing film 27. The second mask pattern 29 may be formed ofphotoresist. The second mask pattern 29 can be a mask pattern forpatterning the gate electrode of NMOS and the gate electrode of PMOS.The second mask pattern 29 may also include a hard mask film patternformed using a photoresist pattern.

Using the second mask pattern 29 as an etch mask, the thirdtungsten-containing film 27, the first tungsten-containing film pattern24B and the second tungsten-containing film pattern 26B are etched.Thus, in the first region NMOS, a first tungsten-containing gateelectrode 201 is formed, and in the second region PMOS, a secondtungsten-containing gate electrode 202 is formed. The firsttungsten-containing gate electrode 201 includes the firsttungsten-containing film pattern 24N and the third tungsten-containingfilm pattern 27N. The second tungsten-containing gate electrode 202includes the second tungsten-containing film pattern 26P and the thirdtungsten-containing film pattern 27P.

Although not shown in the drawings, a gate spacer may be formed on thesidewall of each of the first and second tungsten-containing gateelectrodes 201 and 202. Then, source/drain regions can be formed byion-implanting an impurity.

According to an exemplary embodiment, the gate electrode in NMOScomprises the first tungsten-containing film pattern 24N containing awork function control material. The gate electrode in PMOS comprises thesecond tungsten-containing film pattern 26P containing a work functioncontrol material. In addition, the gate electrode in NMOS and the gateelectrode in PMOS further comprise the third tungsten-containing filmpatterns 27N and 27P, respectively, which are materials for reducing theresistance of the gate electrodes.

Thus, it is possible to independently control each of the thresholdvoltages of NMOS and PMOS in CMOS circuit processes.

Specifically, the gate electrode in PMOS comprises the fluorine-freetungsten nitride containing carbon (FFWNC) having a high work functionof about 4.8 eV or more, and thus has an increased threshold voltage.

In addition, the gate electrode in NMOS comprises the fluorine-freetungsten containing carbon (FFWC) having a low work function of about4.5 eV or less, and thus has a decreased threshold voltage.

In an exemplary embodiment, the tungsten-containing gate electrodescontaining work function control materials can be planar gateelectrodes. In an exemplary embodiment, the tungsten-containing workfunction control materials can be applied to recess gate electrodes,buried gate electrodes or vertical gate electrodes. In addition, thetungsten-containing work function control materials can also be appliedto bit lines. Further, the tungsten-containing work function controlmaterials can also be applied to tungsten plugs.

As described above, a tungsten-containing film containing a workfunction control material is used as a gate electrode in each of NMOSand PMOS, and a double metal gate electrode structure can be formedwhich has not only a work function suitable for each transistor, butalso has low resistance.

In addition, tungsten-containing gate electrodes are formed offluorine-free tungsten. Thus their interfaces with a gate insulatingfilm can have excellent characteristics, and the polysilicon depletionratio (PDR), Fermi-level pinning and resistance characteristics of thegate electrodes can be improved. Thus, a transistor capable of operatingat a high speed can be formed.

Moreover, in order to control threshold voltage so as to be able toachieve low voltage and low power, a carbon-containing tungsten and acarbon-containing tungsten nitride are used for a double metal gateelectrode structure having a work function suitable for each transistor,thereby obtaining excellent memory operating characteristics.

The foregoing description of implementations provides illustration anddescription, but is not intended to be exhaustive or to limit theinvention to the precise form disclosed. Modifications and variationsare possible in light of the above teachings or may be acquired frompractice of the invention.

Even though particular combinations of features are recited in theclaims or disclosed in the specification, these combinations are notintended to limit the disclosure of the invention. In fact, many ofthese features may be combined in ways not specifically recited in theclaims or disclosed in the specification. Although each dependent claimlisted below may directly depend on only one other claim, the disclosureof the invention includes each dependent claim in combination with everyother claim in the claim set.

No element, act, or instruction used in the present application shouldbe construed as critical or essential to the invention unless explicitlydescribed as such. Also, as used herein, the article “a” is intended toinclude one or more items. Where only one item is intended, the term“one” or similar language is used. Further, the phrase “based on” isintended to mean “based, at least in part, on” unless explicitly statedotherwise.

1-15. (canceled)
 16. A method for fabricating a semiconductor device,the method comprising: forming a gate insulating film over an entiresurface of a semiconductor substrate including an NMOS region and a PMOSregion; forming a first tungsten-containing film, containing a firstwork function control material, over the gate insulating film formedover the NMOS region; forming a second tungsten-containing film,containing a second work function control material, over the gateinsulating film formed over the PMOS region; post-annealing thesemiconductor substrate having the first tungsten-containing film andthe second tungsten-containing film formed thereon; and etching thefirst tungsten-containing film and the second tungsten-containing filmto form a gate electrode in the NMOS region and the PMOS region.
 17. Themethod of claim 16, wherein the first work function control materialincludes carbon.
 18. The method of claim 16, wherein the second workfunction control material includes carbon and nitrogen.
 19. The methodof claim 16, wherein forming the first tungsten-containing film and thesecond tungsten-containing film comprises: performing an atomic layerdeposition using a fluorine-free tungsten source containing carbon. 20.The method of claim 19, wherein the first tungsten-containing filmincludes a fluorine-free tungsten containing carbon, and wherein formingthe first tungsten-containing film further comprises: plasma treatingthe first tungsten-containing film with a hydrogen-containing materialto control a carbon content of the first tungsten-containing film. 21.The method of claim 19, wherein the second tungsten-containing filmincludes a fluorine-free tungsten nitride containing carbon, and whereinforming the second tungsten-containing film further comprises: plasmatreating the second tungsten-containing film with a nitrogen-containingmaterial to control a carbon content and a nitrogen content of thesecond tungsten-containing film.
 22. The method of claim 16, furthercomprising: forming a third tungsten-containing film over the firsttungsten-containing film and the second tungsten-containing film. 23.The method of claim 22, wherein forming the third tungsten-containingfilm comprises: forming a tungsten nucleation film over the firsttungsten-containing film and the second tungsten-containing film; andforming a bulk tungsten film over the tungsten nucleation film.
 24. Amethod for fabricating a semiconductor device, the method comprising:forming a gate insulating film over an NMOS region and a PMOS region ofa semiconductor substrate; forming a carbon-containing tungsten over thegate insulating film formed over the NMOS region; forming acarbon-containing tungsten nitride over the gate insulating film formedover the PMOS region; forming a tungsten film over the carbon-containingtungsten and the carbon-containing tungsten nitride; post-annealing thecarbon-containing tungsten and the carbon-containing tungsten nitride;and etching the tungsten film, the carbon-containing tungsten, and thecarbon-containing tungsten nitride, to form a gate electrode in the NMOSregion and the PMOS region.
 25. The method of claim 24, wherein a carboncontent of the carbon-containing tungsten is controlled such that thecarbon content of the first gate electrode is about 10-15 at %.
 26. Themethod of claim 24, further comprising: controlling a carbon content anda nitrogen content of the carbon-containing tungsten nitride so that thecarbon content and the nitrogen content of the second gate electrode areabout 5-10 at % and about 20-30 at %, respectively.